Nitrogen for optimising soldering processes
Using nitrogen to inert the atmosphere during soldering processes has become a generally accepted practice in the electronic assembly industry. Regardless of whether the soldering process is wave, selective or reflow, nitrogen improves the process by enhancing the joint quality and minimising defects.
In wave soldering, the required purity is more important than in re works. In the wave soldering process, the mounted components are led through a series of zones adding flux, heat and wave of melted solder. Nitrogen is added in a closed, gas-tight tunnel system in the machine throughout the entire process.
Some soldering processes take place in a reflow-oven and nitrogen is added through the entire process. The process starts with pre-heating of the mounted circuit boards allowing water, flux activating additives etc. to be dried off the board. Next, a soldering paste, consisting of flux and corns of solder will melt and be applied to islands during the reflow phase. Finally, the soldering joints and parts cool. Nitrogen purity is less important compared to that of wave soldering.
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